Injection molding system
AssigneeSeiko Epson Corporation
InventorsKakeru SASAGAWA, Kei YOKOTA, Kenta ANEGAWA, Seiichiro YAMASHITA, Yuji SHINBARU, Riona HAYASHI
Life of this patent
Estimating the term…
Loading patent…
AssigneeSeiko Epson Corporation
InventorsKakeru SASAGAWA, Kei YOKOTA, Kenta ANEGAWA, Seiichiro YAMASHITA, Yuji SHINBARU, Riona HAYASHI
Estimating the term…
An injection molding system includes: an injection molding machine where a shaping mold is installed; a material supply device supplying a material to the injection molding machine; a temperature controller controlling a temperature of the shaping mold; a dryer drying a material stored in the material supply device; a controller controlling the injection molding machine; and a casing. The injection molding machine, the material supply device, the temperature controller, the dryer, and the controller are provided inside the casing. The casing has a caster and is configured to be movable.
An injection molding system comprising:
Dependencies are inferred from the claim text.