Diversified assembly printed circuit board and method for making the same

A method for making a diversified assembly printed circuit board, wherein the method comprises:

• providing a first printed circuit board and a plurality of second printed circuit boards, wherein the first printed circuit board is provided with a plurality of first conductive metals protruding from a surface of the first printed circuit board, and each of the second printed circuit boards is provided with a plurality of second conductive metals protruding from a surface of each of the second printed circuit boards;
• attaching a laminated adhesive sheet and an isolation film successively to one side of each of the second printed circuit boards to be connected;
• forming a micropore in each of the second conductive metals to be electrically connected, wherein the micropore extends through the laminated adhesive sheet and the isolation film and each of the second conductive metals is exposed in the micropore;
• plugging metal paste into the micropore to form conductive metal paste;
• removing the isolation film;
• attaching each of the second printed circuit boards to the first printed circuit board according to preset connection position requirements;
• and
• compressing the first printed circuit board and the plurality of second printed circuit boards to obtain the diversified assembly printed circuit board;
• wherein at a connection position of each of the second printed circuit boards and the first printed circuit board, the solidified conductive metal paste is arranged between each of the first conductive metals and a corresponding second conductive metal to electrically connect each of the first conductive metals and the corresponding second conductive metal, and the laminated adhesive sheet is arranged between each of the second printed circuit boards and the first printed circuit board to physically connect the second printed circuit boards and the first printed circuit board.