Wiring circuit board and producing method thereof

A method for producing a wiring circuit board comprising:

• a first step of providing a conductive layer,
• a second step of providing an insulating layer so as to cover the conductive layer and have an insulating opening portion exposing a part of a one-side surface in a thickness direction of the conductive layer, and
• a third step of providing a shield layer on a one-side surface in the thickness direction of the insulating layer so as to have a recessed portion disposed at the inside of the insulating opening portion and recessed toward the other side in the thickness direction, wherein
• the third step includes
• a fourth step of providing an adhesive layer on the one-side surface in the thickness direction of the insulating layer, an inner-side surface of the insulating layer facing the insulating opening portion, and the one-side surface in the thickness direction of the conductive layer exposed from the insulating opening portion, and
• a fifth step of providing a main body layer on a one-side surface in the thickness direction of the adhesive layer;
• and
• a ratio (Tb/Ta) of a thickness Tb of the main body layer to a thickness Ta of the adhesive layer is 4 or more.

A method for producing a wiring circuit board comprising:

• a first step of providing a conductive layer,
• a second step of providing an insulating layer so as to cover the conductive layer, and
• a third step of providing a shield layer on a one-side surface in a thickness direction of the insulating layer, wherein
• in the third step, a shield opening portion exposing a part of the one-side surface in the thickness direction of the insulating layer is provided in the shield layer.