Method of manufacturing light emitting device and light emitting device

A method of manufacturing a light emitting device, the method comprising:

• forming grooves by removing a portion of a first resin to form a first groove, removing a portion of a second resin to form a second groove, and removing a portion of a third resin to form a third groove,
• the first groove formed by removing the portion of the first resin of a first light emitting structure including a first light emitting element including a first electrode that is covered by the first resin, the first groove straddling the first resin and the third resin,
• the second groove formed by removing the portion of the second resin of a second light emitting structure including a second light emitting element including a second electrode that is covered by the second resin, the second groove straddling the second resin and the third resin,
• the third groove formed by removing the portion of the third resin of covering a conducting part of a circuit element, the third groove including a portion elongated between the first groove and the second groove in a bottom view, wherein
• at least a portion of the first electrode and a first portion of the conducting part of the circuit element are exposed in the first groove,
• at least a portion of the second electrode and second portion of the conducting part of the circuit element are exposed in the second groove, and
• the third groove is formed in the third resin;
• forming a first wiring including a plurality of independent parts by supplying a first conducting material in the first grove and the second groove;
• and
• forming a second wiring electrically separated from the first wiring by supplying a second conducting material in the third groove.