Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorKanako Komatsu
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Abstract
A semiconductor device includes a semiconductor substrate, an insulating member provided on the semiconductor substrate and an electrode disposed on the semiconductor substrate and on the insulating member. The insulating member includes a plurality of first portions and a plurality of second portions thinner than the first portions. The first portions and the second portions are arranged alternately along a first direction, the first direction being parallel to a region of an upper surface of the semiconductor substrate not contacting the insulating member.
Claims14
A semiconductor device, comprising:
- a semiconductor substrate;
- an insulating member provided on the semiconductor substrate;
- and
- an electrode provided on the semiconductor substrate and on the insulating member,
- the insulating member including
- a plurality of first portions, and
- a plurality of second portions thinner than the first portions,
- the first portions and the second portions being arranged alternately along a first direction, the first direction being parallel to a region of an upper surface of the semiconductor substrate not contacting the insulating member.
A semiconductor device, comprising:
- a semiconductor substrate;
- a plurality of insulating members provided on the semiconductor substrate and arranged to be separated from each other along a first direction;
- and
- an electrode disposed on the semiconductor substrate and on the plurality of insulating members,
- the electrode including
- a base portion extending in the first direction, and
- a plurality of tooth portions extending from the base portion in a second direction crossing the first direction,
- in a vertical direction, the insulating members overlapping the tooth portions, and a region between the insulating members overlapping a region between the tooth portions.
Dependencies are inferred from the claim text.