Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorDaiki YOSHIKAWA
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorDaiki YOSHIKAWA
Estimating the term…
According to one embodiment, a semiconductor device includes first, second, and third electrodes, first, second, and third semiconductor regions, a plurality of ring-shaped regions, and a semi-insulating layer. The second semiconductor region is provided on the first semiconductor region. The third semiconductor region surrounds the second semiconductor region, and is provided on the first semiconductor region. The ring-shaped regions surround the second semiconductor region. The second electrode is provided on the second semiconductor region. The third electrode is provided on the third semiconductor region. The semi-insulating layer contacts the first semiconductor region, the second electrode, the ring-shaped regions, and the third electrode. The ring-shaped regions include first and second ring-shaped regions provided between the first ring-shaped region and the third semiconductor region. A length of the second ring-shaped region in a diametrical direction is shorter than a length of the first ring-shaped region in the diametrical direction.
A semiconductor device, comprising:
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.