Non-volatile memory and method of fabricating the same
AssigneeWinbond Electronics Corp.
InventorsPo-Yen Hsu, Bo-Lun Wu
Life of this patent
Estimating the term…
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AssigneeWinbond Electronics Corp.
InventorsPo-Yen Hsu, Bo-Lun Wu
Estimating the term…
Provided is a non-volatile memory including a conductor layer, a memory device, and a selector. The selector is located between and electrically connected to the memory device and the conductive layer. The selector includes a metal filling layer, a barrier layer, and a rectify layer. The metal filling layer is electrically connected to the memory device. The barrier layer is located on the sidewall and the bottom surface of the metal filling layer. The rectify layer is wrapped around the barrier layer. The rectify layer includes a first portion and a second portion. The first portion is located between the barrier layer on the bottom surface of the metal filling layer and the conductive layer. The second portion and the metal filling layer sandwich the barrier layer on the sidewall of the metal filling layer. The first portion has more diffusion paths of metal ions than the second portion.
A non-volatile memory, comprising:
A method of fabricating a non-volatile memory, comprising:
Dependencies are inferred from the claim text.