Methods for fabricating mechanically stacked multicolor focal plane arrays and detection devices

A method of fabricating a stacked multicolor device, the method comprising:

• forming a first detector by:
• depositing a first ground plane on a first detector substrate, wherein the first ground plane is transmissive to radiation in a predetermined spectral band;
• and
• depositing a first detector structure on the first ground plane;
• forming a second detector by:
• depositing a second ground plane on a second detector substrate, wherein the second ground plane is transmissive to radiation in the predetermined spectral band;
• and
• depositing a second detector structure on the second ground plane;
• depositing a dielectric layer on one of the second ground plane and the first detector structure;
• bonding the first detector to the second detector;
• removing the first detector substrate;
• bonding an optical carrier wafer to the first ground plane;
• and
• removing the second detector substrate.

A method of fabricating a multicolor focal plane array, the method comprising:

• forming a first detector layer by:
• depositing a first detector structure on a first detector substrate;
• and
• depositing a first ground plane on the first detector structure, wherein the first ground plane is transmissive to radiation in a predetermined spectral band;
• bonding an optical carrier wafer to the first ground plane;
• removing the first detector substrate;
• forming a second detector layer by:
• depositing a second detector structure on a second detector substrate;
• and
• depositing a second ground plane on the second detector structure, wherein the second ground plane is transmissive to radiation in the predetermined spectral band;
• depositing a dielectric layer on one of the first detector structure and the second ground plane;
• bonding the first detector layer to the second detector layer such that the dielectric layer is positioned between the first detector structure and the second ground plane;
• removing the second detector substrate;
• and
• forming a plurality of detector devices in the first detector layer and the second detector layer by one of the following:
• prior to bonding the first detector layer to the second detector layer, individually reticulating the first detector layer and the second detector layer to form the plurality of detector devices;
• and
• after bonding the first detector layer to the second detector layer, reticulating the first detector layer and the second detector layer to form the plurality of detector devices;
• and
• wherein each detector device of the plurality of detector devices comprise a first detector formed at least by the first detector structure and the first ground plane and a second detector formed at least by the second detector structure and the second ground plane.