Semiconductor device and method of manufacturing the same

Abstract

In one embodiment, a semiconductor device includes a substrate, a plurality of transistors provided on the substrate. The device further includes a first interconnect layer provided above the transistors and electrically connected to at least one of the transistors, one or more first plugs provided on the first interconnect layer, and a first pad provided on the first plugs. The device further includes a second pad provided on the first pad, one or more second plugs provided on the second pad, and a second interconnect layer provided on the second plugs. The device further includes a memory cell array provided above the second interconnect layer and electrically connected to the second interconnect layer. A number of the second plugs on the second pad is larger than a number of the first plugs under the first pad.

Dependencies are inferred from the claim text.