Semiconductor device and method for manufacturing the same

A method for manufacturing a semiconductor device, the method comprising:

• providing a logic circuit on a first substrate;
• providing a memory cell array over the logic circuit, the memory cell array including a plurality of electrode layers stacked on top of one another and a semiconductor layer provided above the plurality of electrode layers;
• providing a first plug and a second plug over the logic circuit, the first plug and the second plug being electrically connected to the logic circuit;
• forming a bonding pad on the first plug;
• and
• forming a metallic wiring layer on the memory cell array, the metallic wiring layer being electrically connected to the semiconductor layer and the second plug.

A method for manufacturing a semiconductor device, the method comprising:

• forming a logic circuit on a first substrate;
• forming a memory cell array above a second substrate, the memory cell array including a semiconductor layer and a plurality of electrode layers stacked on top of one another over the semiconductor layer;
• forming a first plug and a second plug over the second substrate;
• providing the memory cell array, the first plug, and the second plug over the logic circuit by bonding the first substrate and the second substrate to each other;
• removing the second substrate after bonding the first substrate and the second substrate;
• forming a bonding pad on the first plug after removing the second substrate;
• and
• forming a metallic wiring layer on the memory cell array after removing the second substrate, the metallic wiring layer being electrically connected to the semiconductor layer and the second plug.