Copperless regions to control plating growth

A process, comprising:

• applying a layer of copper to a portion of a side of a substrate;
• removing one or more regions of the layer of copper;
• and
• applying a plating process to a remaining layer of copper to grow a plurality of bumps coupled with the remaining layer of copper, wherein a layout of the removed one or more regions is to vary a growth, respectively, of each of the plurality of bumps coupled with the remaining layer of copper during the plating process by modifying a density of copper, respectively, proximate to each of the plurality of bumps.

A system, comprising:

• a circuit board;
• a package coupled with the circuit board, the package including:
• a substrate with a first side and a second side opposite the first side;
• a copper layer coupled with a first region of the first side of the substrate;
• a plurality of bumps coupled with the first region of the first side of the substrate;
• one or more second regions on the first side of the substrate not coupled with the copper layer;
• and
• wherein a layout of the one or more second regions on the first side of the substrate is to vary a growth, respectively, of each of the plurality of bumps during a plating process by modifying a density of copper, respectively, proximate to each of the plurality of bumps.