Semiconductor device and manufacturing method thereof

A semiconductor device, comprising:

• a substrate including a first layer and a second layer over the first layer;
• a bump disposed over the second layer;
• a molding disposed over the second layer and surrounding the bump;
• and
• a retainer disposed over the second layer, wherein the retainer is disposed between the molding and a periphery of the substrate, and the molding is in contact with at least a portion of the bump.

A semiconductor device, comprising:

• a substrate;
• a bump disposed over the substrate;
• a molding disposed over the substrate and surrounding the bump;
• and
• a retainer disposed over the substrate, wherein the retainer is disposed between the molding and a periphery of the substrate, and the molding is in contact with at least a portion of the bump.