Semiconductor device package and method for packaging the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYu-Che HUANG, Lu-Ming LAI
Life of this patent
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Abstract
A semiconductor device package and a method for packaging the same are provided. A semiconductor device package includes a carrier, an electronic component, a buffer layer, a reinforced structure, and an encapsulant. The electronic component is disposed over the carrier and has an active area. The buffer layer is disposed on the active area of the electronic component. The reinforced structure is disposed on the buffer layer. The encapsulant encapsulates the carrier, the electronic component and the reinforced structure.
Claims20
A semiconductor device package, comprising:
- a carrier;
- an electronic component disposed over the carrier and having an active area;
- a buffer layer disposed on the active area of the electronic component;
- a reinforced structure disposed on the buffer layer;
- and
- an encapsulant encapsulating the carrier, the electronic component and the reinforced structure.
A method for packaging a semiconductor device, comprising:
- providing a carrier;
- disposing an electronic component on the carrier;
- disposing a buffer layer on the electronic component;
- and
- disposing a reinforced structure on the buffer layer.
Dependencies are inferred from the claim text.