Electro-migration barrier for interconnect
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSu-Jen Sung, Chih-Chiang Chang, Chia-Ho Chen
Life of this patent
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Abstract
The present disclosure relates to an integrated circuit having a conductive interconnect disposed on a dielectric over a substrate. A first liner is arranged along an upper surface of the conductive interconnect. A barrier layer is arranged along a lower surface of the conductive interconnect and contacts an upper surface of the dielectric. The barrier layer and the first liner surround the conductive interconnect. A second liner is located over the first liner and has a lower surface contacting the upper surface of the dielectric.
Claims20
An integrated circuit, comprising:
- a conductive interconnect disposed on a dielectric over a substrate;
- a first liner arranged along an upper surface of the conductive interconnect;
- a barrier layer arranged along a lower surface of the conductive interconnect and contacting an upper surface of the dielectric, wherein the barrier layer and the first liner surround the conductive interconnect;
- and
- a second liner located over the first liner and having a lower surface contacting the upper surface of the dielectric.
An integrated circuit, comprising:
- a conductive interconnect disposed over a substrate;
- a first liner arranged along an upper surface of the conductive interconnect;
- a barrier layer arranged along a lower surface of the conductive interconnect, wherein the barrier layer and the first liner surround the conductive interconnect;
- and
- a second liner disposed over the first liner and along sidewalls of the conductive interconnect, wherein the second liner comprises a corner that is both vertically and laterally between the barrier layer and the first liner.
An integrated circuit, comprising:
- a conductive interconnect arranged over a substrate;
- a first liner arranged along an upper surface of the conductive interconnect;
- a barrier layer arranged along a lower surface of the conductive interconnect, wherein the barrier layer and the first liner surround the conductive interconnect;
- and
- a second liner arranged over the first liner and comprising a horizontally extending ledge coupled to an overlying vertically extending surface of the second liner, wherein the horizontally extending ledge is vertically above a top surface of the conductive interconnect.
Dependencies are inferred from the claim text.