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US 2021/0082818 A1Published application
Inductors with through-substrate via cores
AssigneeMicron Technology, Inc.
InventorKyle K. Kirby
Life of this patent
Estimating the term…
Abstract
A semiconductor device comprising a substrate is provided. The device further comprises a through-substrate via (TSV) extending into the substrate, and a substantially helical conductor disposed around the TSV. The substantially helical conductor can be configured to generate a magnetic field in the TSV in response to a current passing through the helical conductor. More than one TSV can be included, and/or more than one substantially helical conductor can be provided.
Claims20
A semiconductor device, comprising:
- a substrate;
- a through-substrate via (TSV) extending into the substrate;
- a first substantially helical conductor disposed around the TSV;
- and
- a second substantially helical conductor disposed around the TSV.
2 more elements
A semiconductor device, comprising:
- a substrate;
- at least one through-substrate via (TSV) extending into the substrate;
- a first substantially helical conductor disposed around the at least one TSV;
- and
- a second substantially helical conductor disposed around the at least one TSV.
2 more elements
A semiconductor device, comprising:
- a substrate;
- and
- a transformer including:
- at least one through-substrate via (TSV) extending into the substrate,
- a first substantially helical conductor disposed around the at least one TSV, and
- a second substantially helical conductor disposed around the at least one TSV,
- wherein the first substantially helical conductor comprises a different number of turns around the TSV than the second substantially helical conductor.
4 more elements
Dependencies are inferred from the claim text.