Fabrication of integrated circuit including passive electrical component

An integrated circuit fabricated upon a substrate, comprising:

• a passive electrical component formed in a non-final layer of the integrated circuit;
• and
• one or more electrical contacts formed in a final layer of the integrated circuit such that the one or more electrical contacts and the passive electrical component are positioned in a manner such that an imaginary line perpendicular to and from a surface of the substrate intersects the passive electrical component and the one or more electrical contacts.

The integrated circuit of claim 7, wherein the one or more electrical contacts comprises an electrical bump.