Heat dissipation structures

A structure, comprising:

• a plurality of vertically stacked chips bonded together through a respective plurality of passivation layers;
• a heat dissipation layer embedded in a passivation layer and comprising an array of first heat dissipating stripes disposed over an array of second heat dissipating stripes;
• and
• thermally conductive structures connecting the first and second heat dissipating stripes.

A stacked structure, comprising:

• a substrate;
• chips vertically stacked over the substrate, wherein the chips are separated by passivation layers and each chip comprises a metallization layer with conductive structures;
• and
• a heat dissipation layer integrated in the metallization layer, wherein the conductive structures of the metallization layer are electrically isolated from and traverse through the heat dissipation layer.