Semiconductor package structure and fabrication method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsYoungho KIM, Hwanpil PARK
Life of this patent
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Abstract
A method of fabricating a semiconductor package structure is provided. The structure is configured to include a base substrate, a die placed on the base substrate, the die including a semiconductor device, a solder bump placed on one surface of the die to exhaust heat generated in the die to an outside; and a solder ball placed on other surface of the die facing the one surface to transmit a signal, which is produced by the semiconductor device of the die, to an external device.
Claims21
1-20. (canceled)
A semiconductor package structure, comprising:
- a re-distribution substrate;
- a die mounted on the re-distribution substrate, the die including a joining pattern;
- a solder bump joined to the joining pattern on the die;
- a polymer resin layer embedding the die on the re-distribution substrate, the solder bump being exposed to an upper surface of the polymer resin layer;
- a base substrate on the polymer resin layer;
- a contact plug connecting the re-distribution substrate and the base substrate on a side of the die;
- and
- an upper package mounted on the base substrate and including an upper substrate and an upper die mounted on the upper substrate,
- wherein the base substrate includes a heat dissipation plug penetrating the base substrate, and
- wherein the solder bump connects the heat dissipation plug and the joining pattern to each other.
A semiconductor package structure, comprising:
- a base substrate including heat dissipation plugs penetrating the base substrate;
- a solder mask disposed on the base substrate, the solder mask defining an opening area that corresponds to at least two of the heat dissipation plugs;
- a die disposed on the base substrate, the heat dissipation plugs being configured to discharge heat generated in the die to an outside;
- a solder bump that is interposed between the die and the opening area, the solder bump being coupled to the base substrate through the opening area;
- a re-distribution layer disposed on the die, the die being mounted at the re-distribution layer;
- a contact plug connecting the re-distribution layer and the base substrate on a side of the die;
- and
- a solder ball disposed on the re-distribution layer and configured to transmit a signal, which is produced by a semiconductor device of the die, to an external device,
- wherein the solder bump is connected to two of the plurality of the heat dissipation plugs.
A semiconductor package structure, comprising:
- a base substrate;
- a die disposed in a cavity of the base substrate;
- a polymer resin layer filling in the cavity;
- a re-distribution layer disposed on the base substrate, the die being mounted at the re-distribution layer;
- a solder bump between a bottom surface of the cavity and the die, the solder bump being joined to the die by a joining pattern;
- a solder mask disposed on the bottom surface of the cavity, the solder mask defining an opening area that corresponds to the solder bump, and
- a solder ball disposed on the re-distribution layer and configured to transmit a signal, which is produced by a semiconductor device of the die, to an external device,
- wherein the solder bump comprises:
- a heat dissipation plug penetrating the base substrate under the cavity;
- and
- a contact plug connecting the re-distribution layer and the base substrate on a side of the cavity, and
- wherein the solder bump is coupled to the heat dissipation plug through the opening area.
Dependencies are inferred from the claim text.