Electrostatic attraction method and plasma processing apparatus

An electrostatic attraction method comprising:

• applying voltages to one or more electrodes disposed in a substrate support while reversing polarities of the voltages for each process cycle for plasma treatment, wherein said one or more electrodes are disposed in the substrate support at at least a position corresponding to a ring member placed on the substrate support to surround a substrate serving as a plasma treatment target placed on the substrate support,
• wherein said each process cycle is a cycle of performing the plasma treatment on a predetermined number of substrates when the plasma treatment is performed consecutively on substrates while exchanging the substrates, and said each process cycle is a cycle of performing a set of the plasma treatment and post-treatment when the plasma treatment is performed and the post-treatment is subsequently performed on each of the substrates.