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US 2021/0080486 A1Published application
Compliant organic substrate assembly for rigid probes
AssigneeInternational Business Machines Corporation
InventorsDavid Audette, Grant Wagner, Marc Knox, Dennis Conti
Life of this patent
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Abstract
A wafer test device and methods of assembling a wafer test device involve a first laminate structure, and a second laminate structure arranged to interface with a microcircuit of the wafer. The wafer test device includes a compliant layer between the first laminate structure and the second laminate structure. The compliant layer includes an elastomer that exhibits compliance within a limited range of movement.
Claims20
A wafer test device, comprising:
- a first laminate structure;
- a second laminate structure arranged to interface with a microcircuit of the wafer;
- and
- a compliant layer between the first laminate structure and the second laminate structure, the compliant layer including an elastomer that exhibits compliance within a limited range of movement.
1 more element
A method of assembling a wafer test device, the method comprising:
- forming a first laminate structure;
- arranging a second laminate structure arranged to interface with a microcircuit of the wafer;
- and
- arranging a compliant layer between the first laminate structure and the second laminate structure, the compliant layer including an elastomer that exhibits compliance within a limited range of movement.
1 more element
Dependencies are inferred from the claim text.