Method for manufacturing a fluid-ejection device with improved resonance frequency and fluid ejection velocity, and fluid-ejection device

A method, comprising:

• forming a first portion of a reservoir having first sidewalls extending into a first semiconductor wafer by a first dimension by selectively removing portions of the first semiconductor wafer;
• forming a second portion of the reservoir having second sidewalls extending into a second semiconductor wafer by a second dimension by selectively removing portions of the second semiconductor wafer, the second dimension being less than the first dimension;
• and
• forming the reservoir being defined by the first sidewalls and the second sidewalls by coupling the first semiconductor wafer to the second semiconductor wafer.

A method, comprising:

• forming a first recess with a first volume in a first semiconductor body;
• forming a nozzle cavity in the first semiconductor body and fluidically coupling the nozzle cavity to the first recess;
• forming a second recess with a second volume less than the first volume in a second semiconductor body;
• forming a chamber having a total volume that includes the first volume and the second volume, forming the chamber including:
• aligning the first recess of the first semiconductor body with the second recess of the second semiconductor body;
• and
• coupling the first semiconductor body to the second semiconductor body.