Back to results
US 2021/0078112 A1Published application
Bonding structure
AssigneeNapra Co., Ltd.
InventorShigenobu SEKINE
Life of this patent
Estimating the term…
Abstract
Disclosed is a bonding structure that includes an intermetallic compound crystal composed of Sn and Cu, and, an Sn alloy matrix composed of Sn and Cu, being intended for bonding a metal body or an alloy body, the intermetallic compound crystal forming an endotaxial junction with the Sn alloy matrix, and the Sn alloy matrix and/or the intermetallic compound crystal forming an epitaxial junction with the metal body or the alloy body.
Claims14
A bonding structure comprising an intermetallic compound crystal composed of Sn and Cu, and, an Sn alloy matrix composed of Sn and Cu, being intended for bonding a metal body or an alloy body,
- the intermetallic compound crystal forming an endotaxial junction with the Sn alloy matrix, and
- the Sn alloy matrix and/or the intermetallic compound crystal forming an epitaxial junction with the metal body or the alloy body.
Dependencies are inferred from the claim text.