Increased mut coupling efficiency and bandwidth via edge groove, virtual pivots, and free boundaries
AssigneeExo Imaging, Inc.
InventorsBrian BIRCUMSHAW, Sandeep AKKARAJU, Haesung KWON
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Abstract
Methods for improving the electromechanical coupling coefficient and bandwidth of micromachined ultrasonic transducers, or MUTs, are presented as well as methods of manufacture of the MUTs improved by the presented methods.
Claims56
A micromachined ultrasonic transducer (MUT) comprising:
- a) a diaphragm with substantially free edges;
- b) one or more electrodes;
- and
- c) one or more anchors clamping the diaphragm at locations within and/or along the diaphragm periphery to a substrate.
A micromachined ultrasonic transducer (MUT) comprising a clamped diaphragm comprising a vertical cantilever shell, the vertical cantilever shell attached to an edge of the diaphragm.
A micromachined ultrasonic transducer (MUT) comprising a clamped diaphragm comprising a groove.
A micromachined ultrasound transducer (MUT) comprising:
- a) a piezoelectric stack comprising a substrate, an insulating layer, a top electrode, a piezoelectric layer, and a bottom electrode,
- wherein the piezoelectric stack has edge portions and a central portion,
- wherein the piezoelectric stack has one or more grooves extending through at least the top electrode, piezoelectric layer, bottom electrode, and insulating layer and into at least a portion of the substrate, and
- wherein the one or more grooves are disposed between the edge portions and the central portion of the piezoelectric stack;
- a) a base;
- b) one or more anchors coupling the central portion of the piezoelectric stack to the base, leaving the edge portions of the piezoelectric stack free and the central portion of the piezoelectric stack is clamped to the base, the one or more anchors providing an electrical coupling between the base to the piezoelectric stack;
- and
- c) a plurality of conductors, the plurality of conductors comprising (i) a first conductor electrically coupling the top electrode of the piezoelectric stack to the base through a first via through the thickness of the piezoelectric stack and (ii) a second conductor electrically coupling the bottom electrode of the piezoelectric stack to the base through a second via through the thickness of the piezoelectric stack,
- wherein the first and second vias are disposed between the edge portions and the central portion of the piezoelectric stack.
Dependencies are inferred from the claim text.