Thermosetting resin composition, and prepreg and metal foil clad laminate made therefrom

A thermosetting resin composition, characterized in that the thermosetting resin composition comprises

• component (A) a solvent soluble polyfunctional vinyl aromatic copolymer having a structural unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b), comprising 20 mol. % or more of repeating units derived from divinyl aromatic compound (a), wherein the molar fraction of the vinyl group-containing structural unit derived from the divinyl aromatic compound (a) represented by the following formulae (a1) and (a2) satisfies (a1)/[(a1)+(a2)]≥0.5;
• the polystyrene-equivalent number average molecular weight Mn measured by gel permeation chromatography is 600 to 30,000;
• and the ratio of the weight average molecular weight Mw to the number average molecular weight Mn is 20.0 or less,
• wherein R13 represents an aromatic hydrocarbon group having 6 to 30 carbon atoms;
• R14 represents an aromatic hydrocarbon group having 6 to 30 carbon atoms;
• and
• component (B) which is selected from olefin resins having a number average molecular weight of 500-10,000, containing 10-50 wt. % of a styrene structure and comprising a butadiene structure added at the 1,2 position in the molecule thereof.