Processing apparatus

A processing apparatus that polishes a back surface side of a wafer on which devices are formed on a front surface side, the processing apparatus comprising:

• a chuck table that holds the wafer and rotates;
• a polishing unit that forms scratches on the back surface side of the wafer while polishing the back surface side of the wafer by pressing a polishing pad containing abrasive grains against the back surface side of the wafer held by the chuck table while rotating the polishing pad;
• a scratch determining unit that determines whether or not the scratches exist on the back surface side of the wafer polished by the polishing unit;
• and
• an informing unit that informs that a region in which the scratches do not exist is included in the wafer when a region for which it has been determined that the scratches do not exist by the scratch determining unit is included in the wafer.