Metallization method for a semiconductor wafer

A metallization method for a semiconductor wafer, the method comprising:

• providing the semiconductor wafer having a top side and a bottom side and at least two solar cell stacks, each solar cell stack has a Ge substrate forming the bottom side of the semiconductor wafer, a Ge subcell, and at least two III-V subcells, and at least one through-hole extending from the top side to the bottom side of the semiconductor wafer with a continuous side wall and a circumference that is oval in cross section;
• applying a photoresist layer in certain areas as a resist pattern via a printing method to the top side or to the bottom side or to the top and bottom sides of the semiconductor wafer;
• applying a metal layer in a planar manner to exposed regions of the surface of the semiconductor wafer, the exposed regions being regions which are coated with the photoresist layer, and to the photoresist layer;
• and
• removing the resist pattern with the metal layer part located thereon from the semiconductor wafer.