Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsYosuke KAJIWARA, Hiroshi ONO, Jumpei TAJIMA, Toshiki HIKOSAKA, Shinya NUNOUE, Masahiko KURAGUCHI
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AssigneeKabushiki Kaisha Toshiba
InventorsYosuke KAJIWARA, Hiroshi ONO, Jumpei TAJIMA, Toshiki HIKOSAKA, Shinya NUNOUE, Masahiko KURAGUCHI
Estimating the term…
According to one embodiment, a semiconductor device includes first to fourth semiconductor regions, and an insulating part. The third electrode is between the first and second electrodes in a first direction from the first electrode toward the second electrode. The first semiconductor region includes Alx1Ga1-x1N and includes first to fifth partial regions. A second direction from the first partial region toward the first electrode crosses the first direction. The second semiconductor region includes Alx2Ga1-x2N and includes sixth and seventh partial regions. The third semiconductor region includes Alx3Ga1-x3N and includes an eighth partial region between the fifth and seventh partial regions. The fourth semiconductor region includes Alx4Ga1-x4N and includes a first portion between the fifth and eighth partial regions. The fourth semiconductor region includes a first element not included the first to third semiconductor regions. The insulating part includes first to third insulating regions.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.