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US 2021/0066465 A1Published application
Method of Forming a Source/Drain
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien-Wei Lee, Hsueh-Chang Sung, Yen-Ru Lee
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Abstract
Embodiments provide a way of treating source/drain recesses with a high heat treatment and an optional hydrogen plasma treatment. The high heat treatment smooths the surfaces inside the recesses and remove oxides and etching byproducts. The hydrogen plasma treatment enlarges the recesses vertically and horizontally and inhibits further oxidation of the surfaces in the recesses.
Claims20
A method comprising:
- forming a fin from a substrate;
- forming a gate structure over the fin;
- etching a source/drain recess on a side of the gate structure;
- heating the source/drain recess at a temperature greater than 700° C., thereby smoothing a surface of the source/drain recess by 6% to 12%;
- and
- growing an epitaxial source/drain region in the source/drain recess.
3 more elements
A method comprising:
- etching a substrate to form a fin therefrom;
- forming a gate structure over the fin, the gate structure comprising a gate stack, a first gate spacer on a first side of the gate stack, and a second gate spacer on a second side of the gate stack;
- etching a recess in the fin on the first side of the gate structure adjacent the first gate spacer;
- treating the recess to remove etching byproducts and oxides of a material of the fin from surfaces in the recess and to smooth the surfaces of the recess;
- and
- forming an epitaxial source/drain region in the recess.
3 more elements
A device comprising:
- a remote plasma chamber, the remote plasma chamber comprising a plasma generator and a gas source;
- a plasma transfer chamber;
- and
- a working chamber, the working chamber comprising a shower head and a pedestal, wherein the shower head and the pedestal are configured to be heated to provide a heat of at least 700° C. to a workpiece on the pedestal, the pedestal comprising a metal alloy and a metal coating over the metal alloy, wherein the plasma transfer chamber connects the remote plasma chamber to the working chamber and is configured to provide products of a plasma to the working chamber.
1 more element
Dependencies are inferred from the claim text.