Capacitors with nanoislands on conductive plates
AssigneeIntel Corporation
InventorsSrinivas PIETAMBARAM, Brandon C. MARIN, Jeremy ECTON, Hiroki TANAKA, Frank TRUONG
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AssigneeIntel Corporation
InventorsSrinivas PIETAMBARAM, Brandon C. MARIN, Jeremy ECTON, Hiroki TANAKA, Frank TRUONG
Estimating the term…
Embodiments herein relate to a capacitor device or a manufacturing process flow for creating a capacitor that includes nanoislands within a package. The capacitor a first conductive plate having a first side and a second side opposite the first side and a second conductive plate having a first side and a second side opposite the first side where the first side of the first conductive plate faces the first side of the second conductive plate. A first plurality of nanoislands is distributed on the first side of the first conductive plate and a second plurality of nanoislands is distributed on the first side of the second conductive plate, where the first conductive plate, the second conductive plate, and the first and second pluralities of nanoislands form a capacitor. The nanoislands may be applied to the conductive plates using a sputtering technique.
A device comprising:
A method comprising:
A package comprising:
Dependencies are inferred from the claim text.