Display device and method for manufacturing the same
AssigneeSamsung Display Co., Ltd.
InventorByoungyong KIM
Life of this patent
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Abstract
A display device includes a display panel including a display substrate and a connection pad disposed on a side surface of the display substrate, and a circuit board including a base board, and a driving pad disposed on the base board to face the connection pad and being in electrical contact with the connection pad. The connection pad includes a top surface, at least a portion of which is recessed to define a recessed space and facing the base board, and a bottom surface facing the side surface of the display substrate. The driving pad is disposed in the recessed space.
Claims20
A display device comprising:
- a display panel comprising a display substrate, and a connection pad disposed on a side surface of the display substrate;
- and
- a circuit board comprising a base board, and a driving pad disposed on the base board to face the connection pad and in electrical contact with the connection pad,
- wherein
- the connection pad includes a top surface of which at least a portion is recessed to define a recessed space and facing the base board, and a bottom surface facing the side surface of the display substrate, and
- the driving pad is disposed in the recessed space.
A display device comprising:
- a display panel comprising a display substrate, and a connection pad disposed on a side surface of the display substrate;
- and
- a circuit board comprising a base board, and a driving pad disposed on the base board to face the connection pad and in electrical contact with the connection pad,
- wherein
- an entire portion of the connection pad overlaps the driving pad in a plan view of the circuit board, and
- the driving pad surrounds the connection pad in the plan view of the circuit board.
A method for manufacturing a display device, the method comprising:
- preparing a display substrate;
- forming a conductive layer by providing a conductive material onto one side surface of the display substrate;
- forming a plurality of connection pads spaced apart from each other by radiating a first laser to the conductive layer;
- performing an aligning process in a way such that driving pads of a circuit board face the connection pads, respectively;
- disposing the driving pads to contact the connection pads, respectively;
- pressing the circuit board in a way such that portions of the connection pads are recessed by the driving pads, respectively;
- and
- radiating a second laser to the connection pads to harden the connection pads.
Dependencies are inferred from the claim text.