Array substrate and method of fabricating same

An array substrate, comprising an active area and a winding area, the array substrate comprising:

• a base substrate;
• an active layer disposed on the base substrate within the active area;
• a first insulating layer disposed on the active layer within the active area and on the base substrate within the winding area;
• a first metal layer disposed on the first insulating layer, wherein the first metal layer comprises at least one first wiring pattern disposed on the first insulating layer within the winding area;
• a second insulating layer disposed on the first metal layer;
• a second metal layer disposed on the second insulating layer, wherein the second metal layer comprises at least one second wiring pattern disposed on the second insulating layer within the winding area;
• a third insulating layer disposed on the second metal layer;
• a third metal layer disposed on the third insulating layer, wherein the third metal layer comprises at least one third wiring pattern disposed on the third insulating layer within the winding area;
• a patterned flat layer disposed on the third metal layer within the active area and on the third metal layer within the winding area;
• a pixel defining layer disposed on the patterned flat layer;
• and
• a support layer disposed on the pixel defining layer, wherein the pixel defining layer together with the support layer have at least one undercut structure.

A method of fabricating an array substrate, the array substrate comprising an active area and a winding area, the method of fabricating the array substrate comprising steps of:

• providing a base substrate;
• forming an active layer on the base substrate within the active area;
• forming a first insulating layer on the active layer within the active area and on the base substrate within the winding area;
• forming a first metal layer on the first insulating layer, wherein the first metal layer comprises at least one first wiring pattern disposed on the first insulating layer within the winding area;
• forming a second insulating layer on the first metal layer;
• forming a second metal layer on the second insulating layer, wherein the second metal layer comprises at least one second wiring pattern disposed on the second insulating layer within the winding area;
• forming a third insulating layer on the second metal layer;
• forming a third metal layer on the third insulating layer, wherein the third metal layer comprises at least one third wiring pattern disposed on the third insulating layer within the winding area;
• forming a patterned flat layer on the third metal layer within the active area and on the third metal layer within the winding area;
• forming a pixel defining layer on the patterned flat layer;
• forming a support layer on the pixel defining layer;
• and
• performing an etching step on the pixel defining layer and the support layer, so that the pixel defining layer together with the support layer after performing the etching step have at least one undercut structure.