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US 2021/0066239 A1Published application
Packaged semiconductor devices with uniform solder joints
OwnerSteffany Ann Lacierda Morenoinventor
Life of this patent
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Abstract
An example apparatus includes a semiconductor die including a bond pad; a conductive post on the bond pad; a solder joint electrically connecting the conductive post to a substrate; and ink residue of solder mask material surrounding a portion of the solder joint, the ink residue covering a portion of the substrate. Methods for forming the apparatus are disclosed.
Claims20
An apparatus, comprising:
- a semiconductor die including a bond pad electrically connected to a circuitry in the semiconductor die;
- a conductive post on the bond pad;
- a solder joint electrically connecting the conductive post to a substrate;
- and
- ink residue of solder mask material contacting and surrounding a portion of the solder joint, the ink residue covering a portion of the substrate.
2 more elements
A method for forming an apparatus, comprising:
- ink-jet depositing material forming an ink residue surrounding a portion of a solder joint area and covering a portion of a surface of a substrate;
- bringing a solder bump that is atop a conductive post, the conductive post directly on a bond pad of a semiconductor die, into contact with the solder joint area;
- and
- melting the solder bump and forming a solder joint between the conductive post and the surface of the substrate, the solder joint partially surrounded by the ink residue.
1 more element
A method for forming a packaged semiconductor device, comprising:
- ink jet depositing a material on a substrate, forming ink residue around a portion of a solder joint area on a surface of substrates on a substrate strip;
- bringing solder atop conductive posts on a bond pad on a semiconductor die into contact with the substrate in a solder joint area;
- melting the solder to electrically connect the conductive posts and the surface of the substrates, the ink residue surrounding a portion of the solder joint areas and covering a portion of the substrates;
- covering the surface of the substrates, the solder, the ink residue, the conductive posts, and the semiconductor dies with mold compound;
- and
- cutting through the mold compound and the substrate strip along saw streets between substrates of the substrate strip to singulate packaged semiconductor devices.
3 more elements
Dependencies are inferred from the claim text.