Apparatus and method for processing substrate

Abstract

A method for processing a substrate includes a liquid treatment step of performing liquid treatment on the substrate by dispensing a treatment liquid onto the rotating substrate and a cleaning step of stopping the dispensing of the treatment liquid and dispensing a cleaning solution onto the substrate. In the cleaning step, a first liquid is dispensed from a first nozzle above the rotating substrate to a point spaced apart from the center of the substrate in a first direction, and a second liquid is dispensed from a second nozzle above the rotating substrate to a point spaced apart from the center of the substrate in a second direction. When viewed from above, the first liquid flows toward the second nozzle after dispensed onto the substrate, and the second liquid flows toward the first nozzle after dispensed onto the substrate.

Dependencies are inferred from the claim text.