Semiconductor wafer, manufacturing method for semiconductor wafer, and manufacturing method for semiconductor device
AssigneeKioxia Corporation
InventorsTakashi KOIKE, Manabu Takakuwa
Life of this patent
Estimating the term…
Abstract
A semiconductor wafer according to an embodiment includes a support region facing a support member, an outer circumferential region positioned on an outer side of the support region, and an inner circumferential region positioned on an inner side of the support region. The outer circumferential region has a convex portion with a thickness protruded upward with respect to the inner circumferential region or a concave portion with a thickness recessed downward with respect to the inner circumferential region.
Claims10
A semiconductor wafer comprising:
- a support region facing a support member;
- an outer circumferential region positioned on an outer side of the support region;
- and
- an inner circumferential region positioned on an inner side of the support region, wherein
- the outer circumferential region has a convex portion with a thickness protruded upward with respect to the inner circumferential region or a concave portion with a thickness recessed downward with respect to the inner circumferential region.
A manufacturing method for a semiconductor wafer comprising a support region facing a support member, an outer circumferential region positioned on an outer side of the support region, and an inner circumferential region positioned on an inner side of the support region, the method comprising
- forming a convex portion with a thickness protruded upward with respect to the inner circumferential region or a concave portion with a thickness recessed downward with respect to the inner circumferential region, on the outer circumferential region.
A manufacturing method for a semiconductor device, the method comprising:
- supporting a semiconductor wafer with a support member provided between an outer circumferential region and an inner circumferential region, the wafer comprising a convex portion with a thickness protruded upward with respect to the inner circumferential region or a concave portion with a thickness recessed downward with respect to the inner circumferential region, the convex portion or the concave portion being formed on the outer circumferential region;
- and
- processing one of surfaces of the semiconductor wafer supported by the support member.
Dependencies are inferred from the claim text.