Spacer Etching Process
AssigneesMattson Technology, Inc., Beijing E-Town Semiconductor Technology Co., Ltd.
InventorsTsai Wen Sung, Chun Yan, Michael X. Yang
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AssigneesMattson Technology, Inc., Beijing E-Town Semiconductor Technology Co., Ltd.
InventorsTsai Wen Sung, Chun Yan, Michael X. Yang
Estimating the term…
Systems and methods for processing a workpiece are provided. In one example, a method includes placing a workpiece on a workpiece support in a processing chamber. The workpiece has at least one material layer and at least one structure thereon. The method includes admitting a process gas into a plasma chamber, generating one or more species from the process gas, and filtering the one or more species to create a filtered mixture. The method further includes providing RF power to a bias electrode to generate a second mixture and exposing the workpiece to the second mixture to etch a least a portion of the material layer and to form a film on at least a portion of the material layer.
A method for processing a workpiece in a plasma processing apparatus, the plasma processing apparatus comprising a plasma chamber having an interior operable to receive a process gas and a processing chamber having a workpiece support operable to support a workpiece, wherein the workpiece comprises at least one spacer layer and at least one mandrel structure, further wherein the plasma processing apparatus comprises an induction coil disposed about the plasma chamber and a bias electrode disposed in the workpiece support, the method comprising:
The method of claim I, wherein the process gas further comprises a diluent gas, wherein the diluent gas comprises Ar, He, N2, O2, and mixtures thereof.
A plasma processing apparatus, comprising:
Dependencies are inferred from the claim text.