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US 2021/0065591 A1Published application
Foldable backplate, method for manufacturing foldable backplate, and foldable display device comprising same
AssigneeLG Chem, Ltd.
InventorsHee SONG, Hyon Gyu PARK, Hyun Cheol KIM
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Abstract
Provided are a foldable back plate, a method of manufacturing the same and a foldable display device comprising the same.
Claims15
A foldable back plate comprising:
- a polyimide (PI) substrate;
- a first adhesive layer provided on a surface of the polyimide substrate;
- and
- a second adhesive layer provided on a surface opposite to the surface of the polyimide substrate in contact with the first adhesive layer,
- wherein a storage modulus (G1) at 20° C. of the polyimide substrate satisfies Equation 1,
- 1 GPa≤G1≤5 GPa [Equation 1]
- wherein, an initial adhesive force of the first adhesive layer is at least 500 gf/inch, and
- an initial adhesive force of the second adhesive layer is at least 500 gf/inch, and
- wherein the initial adhesive force is measured at 23° C. after attaching a polyimide (PI) to the first adhesive layer or to the second adhesive layer on a surface opposite of the surface of the first adhesive layer or the second adhesive layer that is in contact with the polyimide substrate and then the polyimide-attached first adhesive layer or the polyimide-attached second adhesive layer standing at 23° C. for 2 hours.
6 more elements
A method of manufacturing a foldable back plate comprising:
- providing a polyimide (PI) substrate;
- coating a first adhesive layer on a surface of the polyimide substrate;
- laminating a first release film on a surface opposite to the surface of the first adhesive layer in contact with the polyimide substrate;
- providing a second release film;
- coating a second adhesive layer on a surface of the second release film;
- and
- laminating a surface opposite to the surface of the second adhesive layer in contact with the second release film on a surface opposite to the surface of the polyimide substrate in contact with the first adhesive layer,
- wherein a storage modulus (G1) at 20° C. of the polyimide substrate satisfies Equation 1:
- 1 GPa≤G1≤5 GPa [Equation 1]
- a peel force at 23° C. of the second release film from the second adhesive layer is 20 gf/inch or less, and
- a peel force at 23° C. of the first release film from the first adhesive layer is lower than the peel force of the second release film from the second adhesive layer.
8 more elements
Dependencies are inferred from the claim text.