Method for producing display device

A method for manufacturing a display device comprising a pixel circuit formed on a substrate,

• wherein a manufacturing process of the pixel circuit includes a patterning step of a metal film performed in the following procedures (a) to (e):
• (a) forming the metal film on the substrate;
• (b) forming a first resist pattern on the metal film by a photolithographic method;
• (c) etching the metal film with the first resist pattern to form a first metal pattern;
• (d) forming by the photolithographic method on the metal film formed in the first metal pattern, a second resist pattern including a pattern shape smaller than a pattern shape of the first resist pattern;
• and
• (e) etching the metal film with the second resist pattern to form a second metal pattern,
• the first resist pattern and the second resist pattern include different patterns from each other, and
• the first resist pattern includes the pattern shape simpler than the second resist pattern and divides at least bus lines traversing from one end to the other end of a display region.

A method for manufacturing a display device comprising a pixel circuit formed on a substrate,

• wherein a manufacturing process of the pixel circuit includes a patterning step of a metal film performed in the following procedures (a) to (e):
• (a) forming the metal film on the substrate;
• (b) forming a first resist pattern on the metal film by a photolithographic method;
• (c) etching the metal film with the first resist pattern to form a first metal pattern;
• (d) forming by the photolithographic method on the metal film formed in the first metal pattern, a second resist pattern including a pattern shape smaller than a pattern shape of the first resist pattern;
• and
• (e) etching the metal film with the second resist pattern to form a second metal pattern, and
• the patterning step is applied to forming of a metal layer including a source signal line in the display device.

A method for manufacturing a display device comprising a pixel circuit formed on a substrate,

• wherein a manufacturing process of the pixel circuit includes a patterning step of a metal film performed in the following procedures (a) to (e):
• (a) forming the metal film on the substrate;
• (b) forming a first resist pattern on the metal film by a photolithographic method;
• (c) etching the metal film with the first resist pattern to form a first metal pattern;
• (d) forming by the photolithographic method on the metal film formed in the first metal pattern, a second resist pattern including a pattern shape smaller than a pattern shape of the first resist pattern;
• and
• (e) etching the metal film with the second resist pattern to form a second metal pattern,
• the first resist pattern and the second resist pattern include the same pattern,
• the first resist pattern is formed to include a line width larger in a wiring line pattern than that of the second resist pattern,
• in the step (b) and the step (d), the first resist pattern and the second resist pattern are formed by using the same photomask, and
• an exposure amount in step (b) is less than an exposure amount in step (d).