Flexible ceramic waveguides for terahertz applications and use as on-board interconnects

An electronic assembly, comprising:

• a printed circuit board (PCB) assembly comprising first and second ends and at least one PCB layer wherein the at least one PCB layer comprises at least one conductive element,
• an integrated circuit (IC) operably disposed on the top surface of the PCB assembly by I/O pads, the IC having at least one IC device,
• at least one coupling element;
• a ceramic dielectric terahertz (THz) waveguide for guiding signals having a THz frequency in the range from about 0.1 THz to about 10 THz comprising
• a ceramic core comprising an alumina ribbon wherein the alumina ribbon has a dielectric constant (Dk1) and
• a cladding surrounding the ceramic core, wherein the cladding has a dielectric constant (Dk2) such that Dk2<Dk1, and
• a major surface and an access aperture wherein the major surface is disposed between the first end and second end, and the ceramic dielectric waveguide is mounted to the top surface of at least one PCB layer, the ceramic dielectric terahertz (THz) waveguide comprising a first-end section with an end face accessible through the access aperture.