Socket side thermal system

An integrated circuit device testing system comprising:

• a socket configured to receive an integrated circuit device, the socket comprising a plurality of electrical contacts configured to contact electrical contacts of the integrated circuit device;
• a thermally conductive substrate including thin film circuitry electrically connected to the electrical contacts of the socket;
• a load board electrically connected to the thermally conductive substrate via load board electrical contacts and configured to electrically connect the electrical contacts of the socket to a controller or active circuit;
• and
• a thermal unit configured to heat and/or cool the integrated circuit device on a first, socket side of the integrated circuit device while the integrated circuit device is engaged with the socket, via the thermally conductive substrate.

An integrated circuit device testing system comprising:

• a socket configured to receive an integrated circuit device, including:
• a base member comprising a plurality of electrical contacts, and
• a floating plate supported by the base member via at least one spring, the floating plate comprising a plurality of floating plate openings configured to allow electrical contacts of the integrated circuit device to electrically engage with the electrical contacts of the base member through the floating plate openings;
• and
• a first thermal unit configured to control a temperature of the socket-side of the integrated circuit device via controlling the temperature of the electrical contacts.

An integrated circuit device testing system comprising:

• a socket configured to receive an integrated circuit device, including:
• a base member comprising a plurality of electrical contacts, and
• a floating plate supported by the base member via at least one spring, the floating plate comprising a plurality of floating plate openings configured to allow electrical contacts of the integrated circuit device to electrically engage with the electrical contacts of the base member through the floating plate openings;
• and
• a first thermal unit configured to control a temperature of the socket-side of the integrated circuit device disposed between the floating plate and the integrated circuit device.

An integrated circuit device testing system comprising:

• a socket configured to receive an integrated circuit device, the socket including a flexible circuit board having thermal vias;
• a thermal interface in thermal contact with the flexible circuit board;
• and
• a first thermal unit in thermal contact with thermal interface.

An integrated circuit device testing system comprising:

• a socket configured to receive an integrated circuit device;
• a thermal unit;
• a load board configured to electrically connect to the integrated circuit device;
• and
• a controller or active circuit configured to control the thermal unit, disposed on or integrated with the load board.

An integrated circuit device testing system comprising:

• a socket configured to receive an integrated circuit device;
• a thermal unit;
• and
• a controller or active circuit configured to control the thermal unit, disposed on or integrated with the thermal unit.

An integrated circuit device testing system comprising:

• a socket configured to receive an integrated circuit device;
• a temperature-sensitive component which exhibits a temperature-dependent characteristic;
• a controller or active circuit configured to determine a temperature of the integrated circuit device based on a measurement of the temperature-dependent characteristic of the temperature-sensitive component;
• and
• wherein the controller or active circuit is disposed on or integrated with the socket.

An integrated circuit device testing system comprising:

• a socket configured to receive an integrated circuit device;
• a temperature-sensitive component which exhibits a temperature-dependent characteristic;
• a controller or active circuit configured to determine a temperature of the integrated circuit device based on a measurement of the temperature-dependent characteristic of the temperature-sensitive component;
• and
• a load board configured to electrically connect to the integrated circuit device;
• wherein the controller or active circuit is disposed on or integrated with the load board.

An integrated circuit device testing system comprising:

• a socket configured to receive an integrated circuit device;
• a temperature-sensitive component which exhibits a temperature-dependent characteristic;
• a controller or active circuit configured to determine a temperature of the integrated circuit device based on a measurement of the temperature-dependent characteristic of the temperature-sensitive component;
• and
• a thermal unit configured to control a temperature of the integrated circuit device;
• wherein the controller or active circuit is disposed on or integrated with the thermal unit.