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AssigneeSungrow Power Supply Co., Ltd.
InventorsJie ZHOU, Peng CHEN, Liwen HU, Pengli AI, Peng WANG, Gaozhou TAO
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A heat dissipation device of an inverter is provided disclosed by the present application, which includes a heat sink base, a cooling module and a temperature equalizing plate arranged on the heat sink base. The cooling module is configured to dissipate heat from the heat sink base, the temperature equalizing plate is provided with a part mounting seat, and the heat sink base is arranged between the cooling module and the temperature equalizing plate. When in use, the heat sink base is mounted on the cooling module, the temperature equalizing plate is mounted on the heat sink base, and parts of the device are mounted on the part mounting seat.
A heat dissipation device of an inverter, comprising a heat sink base (3), and a cooling module (4) for dissipating heat from the heat sink base (3), wherein the heat dissipation device further comprises a temperature equalizing plate (2) arranged on the heat sink base (3), the temperature equalizing plate (2) is provided with a part mounting seat, and the heat sink base (3) is arranged between the cooling module (4) and the temperature equalizing plate (2).
Dependencies are inferred from the claim text.