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US 2021/0062353 A1Published application
Leveling agent and copper plating composition comprising the same
AssigneeSoulbrain Co., Ltd.
InventorsJong Cheol YUN, Wan Joong KIM, Hee Jeong RYU
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Abstract
The present invention relates to a A copper plating composition, comprising a metal ion supply source, an electrolyte, and a leveling agent comprising a thioamide compound that comprises at least one of a homocyclic aromatic ring and a heterocyclic aromatic ring. Excellently smooth plated surfaces with minimized defects can be obtained when a feature formed on a substrate are plated by using the copper plating composition.
Claims10
A copper plating composition, comprising:
- a metal ion supply source,
- an electrolyte, and
- a leveling agent comprising a thioamide compound that comprises at least one of a homocyclic aromatic ring and a heterocyclic aromatic ring.
Dependencies are inferred from the claim text.