Edge trimming apparatus

An edge trimming apparatus comprising:

• a chuck table that has a ring-shaped groove with an outer diameter smaller than an outer diameter of a wafer and causes the ring-shaped groove to communicate with a suction source to hold under suction a lower surface of the wafer by the ring-shaped groove;
• a table rotation mechanism that rotates the chuck table;
• a cutting unit that rotates a spindle on which a cutting blade is mounted and annularly cuts a circumferential part of the wafer held by the chuck table;
• and
• a cleaning unit that cleans a region outside the ring-shaped groove in an upper surface of the chuck table and the upper surface of the chuck table including the ring-shaped groove,
• wherein
• the cleaning unit is positioned to the region outside the ring-shaped groove in the upper surface of the chuck table and the upper surface of the chuck table including the ring-shaped groove, and the chuck table is rotated by the table rotation mechanism, to clean the region outside the ring-shaped groove in the upper surface of the chuck table and the upper surface of the chuck table including the ring-shaped groove.