Thermal substrate with high-resistance magnification and positive temperature coefficient

A printed circuit comprising:

• a substrate;
• a double-resin ink having a positive temperature coefficient (PTC);
• and
• electrical interconnects;
• wherein:
• the substrate is a fabric or mesh;
• the double-resin ink and the electrical interconnects are deposited onto the substrate;
• the double-resin ink comprises:
• a first resin comprising a crystalline or a semi-crystalline polymer;
• and a second resin comprising a non-crystalline polymer;
• and
• the double-resin ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the double-resin ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature ‘T’ and a resistance of the double-resin ink at 25 degrees Celsius.