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AssigneeAstec International Limited
InventorsPrabou Ranganathan, Norman Oliva
Estimating the term…
A power supply comprises a main circuit board and a multilayer power transmission board electrically coupled to the main circuit board. The multilayer board includes a conductive neutral layer having an inner side, a conductive line layer having an inner side facing the inner side of the conductive neutral layer, and a dielectric medium positioned between the conductive neutral layer and the conductive line layer. The power supply also comprises a first conductive outer layer positioned adjacently to an outer side of the conductive neutral layer, a second conductive outer layer positioned adjacently to an outer side of the conductive line layer, and a conductive plating material positioned within a slot formed in the multilayer power transmission board and covering an interior portion of the multilayer power transmission board facing the slot. The conductive plating material electrically couples the first and second conductive outer layers.
A power supply comprising:
A power assembly comprising:
A method of manufacturing a power supply including a main circuit board and a power transmission multilayer board, the power transmission multilayer board including a conductive neutral layer having an inner side facing the inner side of the conductive line layer and having an outer side, a conductive line layer having an inner side and an outer side, a dielectric medium positioned between the conductive neutral layer and the conductive line layer, a first conductive ground layer positioned adjacently to the outer side of the conductive neutral layer, and a second conductive ground layer positioned adjacently to the outer side of the conductive line layer, the method comprising:
Dependencies are inferred from the claim text.