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US 2021/0005477 A1Published application
Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsRyou Son, Sinya Sasaki, Hiroyuki Kondo, Syuntaro Tamaraya, Takaaki Kikuchi
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Abstract
A substrate processing apparatus includes an inner wall formed of a heat conductive material, a quartz liner that covers the inner wall, and a cooling unit that cools the inner wall. A gap is formed between the inner wall and the quartz liner, and a sealing member is provided in the gap to seal the gap. The gap is filled with a heat conductive medium.
Claims15
A substrate processing apparatus comprising:
- an inner wall formed of a heat conductive material;
- a quartz liner that covers the inner wall;
- a first gap formed between the inner wall and the quartz liner, the first gap being filled with a first heat conductive medium;
- a first sealing member provided between the inner wall and the quartz liner, to seal the first gap;
- and
- a cooling unit that cools the inner wall.
3 more elements
Dependencies are inferred from the claim text.