Process for producing sputtering target and sputtering target
AssigneeSumitomo Chemical Company, Limited
InventorMikio TAKIGAWA
Life of this patent
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Abstract
A process for producing a sputtering target in which a target material is diffusion-bonded to a backing plate material having an annular frame part, the method comprising: an incorporating step of incorporating the target material inside the frame part of the backing plate material in such a manner that the uppermost position of the target material becomes higher than the uppermost position of the frame part of the backing plate material in a height direction of the frame part of the backing plate material; and a bonding step of diffusion-bonding the target material to the backing plate material.
Claims2
A sputtering target comprising:
- a backing plate material having an annular frame part;
- and
- a target material fit inside the frame part of the backing plate material;
- wherein the uppermost position of the target material is higher than the uppermost position of the frame part of the backing plate material in a height direction of the frame part of the backing plate material,
- said target material having a hardness smaller than the backing plate material.
A bonded body for producing a sputtering target, comprising:
- a backing plate material having an annular frame part;
- and
- a target material fit inside the frame part of the backing plate material;
- wherein the uppermost position of the target material is higher than the uppermost position of the frame part of the backing plate material in a height direction of the frame part of the backing plate material,
- said target material having a hardness smaller than the backing plate material.
Dependencies are inferred from the claim text.