Electronic arrangement and method of manufacturing the same

An electronic arrangement, comprising

• an array of electronic components arranged on a layer of a layer stack and along a first axis, A, and
• the layer stack being formed as a carrier arranged to support the array of electronic components, wherein the carrier comprises, in a direction perpendicular to the first axis and perpendicular to the layer stack, a first metal layer and a second metal layer, wherein an at least partially insulating layer is arranged between the first and second metal layers, and
• at least one partition portion arranged between two adjacently arranged electronic components for partitioning the electronic arrangement along a second axis, B, of the at least one partition portion, wherein the second axis extends perpendicular to the first axis,
• wherein the second metal layer, at the at least one partition portion, comprises at least one void intersected by the second axis, wherein the at least one void has a width which extends parallel to the first axis, such that, at the second axis, the second metal layer is undercut with respect to the first metal layer, in a direction parallel to the first axis.