Wiring board including metal piece and method for manufacturing wiring board including metal piece
AssigneeFujikura Ltd.
InventorTakaharu Hondo
Life of this patent
Estimating the term…
Abstract
A wiring board includes: a flexible printed circuit board that includes: a base having a first opening; a wiring pattern formed on the base; and a cover lay that includes an adhesive layer adhering to the wiring pattern and that has a second opening; and a metal cover that covers at least a part of the first opening from below. The wiring pattern contacts the metal cover through the first opening, and is bonded to the metal cover. At least a part of the second opening overlaps the first opening in a plan view. A part of the cover lay overlaps the first opening in a plan view.
Claims7
A wiring board comprising:
- a flexible printed circuit board that comprises:
- a base having a first opening;
- a wiring pattern formed on the base;
- and
- a cover lay that comprises an adhesive layer adhering to the wiring pattern and that has a second opening;
- and
- a metal cover that covers at least a part of the first opening from below, wherein
- the wiring pattern contacts the metal cover through the first opening, and is bonded to the metal cover,
- at least a part of the second opening overlaps the first opening in a plan view of the wiring board, and
- a part of the cover lay overlaps the first opening in the plan view.
A wiring board comprising:
- a flexible printed circuit board that comprises:
- a lower cover lay having a first opening;
- an upper cover lay having a second opening;
- and
- a wiring pattern disposed between the lower cover lay and the upper cover lay;
- and
- a metal cover that covers at least a part of the first opening from below, wherein
- the wiring pattern contacts the metal cover through the first opening, and is bonded to the metal cover,
- the lower cover lay comprises:
- a lower adhesive layer contacting the wiring pattern;
- and
- a lower film adhered to the wiring pattern via the lower adhesive layer, and a part of the first opening is located inside the second opening in a plan view of the wiring board.
A method for manufacturing a wiring board, the method comprising:
- preparing a flexible printed circuit board that comprises:
- a base having a first opening;
- a cover lay having a second opening;
- and
- a wiring pattern sandwiched between the base and the cover lay;
- pressing the wiring pattern through the second opening by a bonding tool, and deforming the wiring pattern toward a metal cover;
- and
- bonding together the wiring pattern and the metal cover using the bonding tool.
Dependencies are inferred from the claim text.