Circuit Board using non-catalytic laminate with catalytic adhesive overlay

A circuit board comprising:

• a non-catalytic dielectric having at least one aperture between opposite surfaces;
• a catalytic adhesive coating the surface of the non-catalytic dielectric, the catalytic adhesive having catalytic particles dispersed in a resin, the catalytic particles present an exclusion depth below a surface of the catalytic adhesive such that electroless plating only occurs where catalytic particles are exposed by removing a surface of the catalytic adhesive to at least the exclusion depth below the surface;
• channels formed in the catalytic adhesive below the exclusion depth on at least one surface of the catalytic dielectric;
• at least one aperture formed through the dielectric adhesive exposing catalytic particles of the catalytic adhesive and not exposing the non-catalytic dielectric;
• electroless copper plated in the channels and the at least one aperture, thereby electrically connecting channels with copper in one surface to channels with copper on an opposite surface.

A method for making a circuit layer comprising:

• forming at least one aperture in a non-catalytic dielectric layer;
• coating the non-catalytic dielectric layer and the at least one aperture with a catalytic adhesive, the catalytic adhesive having catalytic particles dispersed in a resin, the catalytic particles present an exclusion depth below a surface of the catalytic adhesive such that electroless plating only occurs where catalytic particles are exposed by removing the surface of the catalytic adhesive to at least the exclusion depth below a surface of the catalytic adhesive;
• forming at least one hole through the catalytic adhesive and the at least one aperture, the at least one hole exposing the catalytic particles;
• forming channels in the catalytic adhesive below the exclusion depth on at least one surface of the catalytic adhesive, at least one channel terminating in the at least one hole;
• immersing the catalytic adhesive with channels and apertures in electroless copper until copper plates onto the channels and the at least one hole.