Micro-roughened electrodeposited copper foil and copper clad laminate

A micro-roughened electrodeposited copper foil, comprising:

• a micro-rough surface, having multiple copper nodule-free areas and multiple copper nodule-arranged areas, in which part of the copper nodule-free areas are dispersed among the copper nodule-arranged areas;
• multiple copper nodules, being formed on the micro-rough surface and located in the copper nodule-arranged areas, in which the copper nodules are not located in the copper nodule-free areas, and the copper nodules in each copper nodule-arranged area are arranged and formed along a direction on the micro-rough surface;
• wherein, in the micro-rough surface of 120 μm2, the number of the copper nodule-free areas is 5 or higher, each copper nodule-free area has a size of 62500 nm2 or higher, each copper nodule-arranged area has a length of 300 nm to 2500 nm, the copper nodules in each copper nodule-arranged area have a mean width of 10 nm to 300 nm, and the number of the copper nodules in each copper nodule-arranged area is 3 to 50.